- Country: United Kingdom
- Summary: Wafer Dicing Saw
- GBT Ref No: 81584364
- Deadline: 26 Apr 2023
- Financier: Self Financed
- Purchaser Ownership: Government
- Tender Value: Refer Document
- Notice Type: Tender
- Document Ref. No.: APR476026
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- Description:
- Tenders should demonstrate that the supplier possesses a comprehensive process library and clearly show the ability to cut glass, quartz, sapphire, silicon and SiC substrates.Tenders should address how a 1 mm thick, 150 mm square glass substrates can be diced.
Wafer Dicing Saw
Purchaser : University of St Andrews
Published : 12/04/2023
Deadline : 2023-04-26 - Documents:
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CLICK HERE TO LOGINWafer Dicing Saw - Uk Tender
The UNIVERSITY OF ST ANDREWS, a Government sector organization in United Kingdom, has announced a new tender for Wafer Dicing Saw. This tender is published on UkTender under GBT Ref No: 81584364 and is categorized as a Tender. Interested and eligible suppliers are invited to participate by reviewing the tender documents and submitting their bids before the deadline on 2023-04-26.
The estimated tender value is Refer Document, and full details, including technical specifications and submission requirements, are provided in the official tender documents. Ensure all submissions meet the criteria outlined to be considered for evaluation.
