- Country: United Kingdom
- Summary: Nmis Power Electronics Advanced Packaging Semiconductor Facility, Dedicated Die Bonding, Wire Bonding, and Encapsulation Equipment.
- GBT Ref No: 94174145
- Deadline: 05 Feb 2024
- Financier: Self Financed
- Purchaser Ownership: Government
- Tender Value: Refer Document
- Notice Type: Tender
- Document Ref. No.: DEC461470
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- Description:
- NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The initial focus will be procuring equipment to support die bonding, wire bonding and encapsulation and associated ancillaries required.
Title: NMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment.
OCID: ocds-h6vhtk-03f66f
Published by: University of Strathclyde
Authority ID: AA20484
Publication Date: 22/12/2023
Deadline Date: 05/02/2024
Deadline Time: 12:00
Notice Type: Contract Notice
Has Documents: No
Has SPD: No
Abstract: NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is able to support a wide variety of power electronic semiconductor designs and packaging requirements.The concept design for the facility includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The items procured will enable NMIS to set up a research fa... - Documents:
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CLICK HERE TO LOGINNmis Power Electronics Advanced Packaging Semiconductor Facility, Dedicated Die Bonding, Wire Bonding, and Encapsulation Equipment. - Uk Tender
The UNIVERSITY OF STRATHCLYDE, a Government sector organization in United Kingdom, has announced a new tender for Nmis Power Electronics Advanced Packaging Semiconductor Facility, Dedicated Die Bonding, Wire Bonding, and Encapsulation Equipment.. This tender is published on UkTender under GBT Ref No: 94174145 and is categorized as a Tender. Interested and eligible suppliers are invited to participate by reviewing the tender documents and submitting their bids before the deadline on 2024-02-05.
The estimated tender value is Refer Document, and full details, including technical specifications and submission requirements, are provided in the official tender documents. Ensure all submissions meet the criteria outlined to be considered for evaluation.
